FR 1 Simple NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask
Specifications
Item | Requirement | Result | ACC | REJ |
Laminate | Type | FR-1 | FR-1 | √ | |
Supplier | KB | KB | √ | |
Board thickness | 1.60±10% mm | 1.61-1.65 mm | √ | |
Outer copper foil | >=35 um | 44.17 | √ | |
Inner copper foil | / | / | √ | |
Warp-twist | <= 0.75% | 0.68% | √ | |
legend | Type | KUANG SHUN | KUANG SHUN | √ | |
Color | Black | Black | √ | |
Location | CS | CS | √ | |
Marking | Co.logo | / | / | √ | |
UL.logo | / | / | √ | |
Date code | / | / | √ | |
Marking form | / | / | √ | |
Location | / | / | √ | |
Min line width (mil) | 7.874 | 8.1 | √ | |
Min line spacing (mil) | 6.5 | 6.3 | √ | |
Min ring width (mil) | NA | NA | / | |
Solder Mask | Type | / | / | √ | |
Color | / | / | √ | |
Thickness | / | / | √ | |
Pencil Test | / | / | √ | |
SOLVENT TEST | / | / | √ | |
TAPE TEST | / | / | √ | |
Surface treament | Lead free HASL | OK | √ | |
Special Treament | Silk screen | / | / | √ | |
Location | / | / | √ | |
Forming | V-cut | OK | √ | |
Normal Testing | Electrical test | 100% PCB passed | OK | √ | |
Visual inspection | IPC-A-600H&IPC-6012B | OK | √ | |
Solderability Test | 245℃ 5S 1 Cycle | OK | √ | |
Final inspection report |
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm) |
NO | Required | PTH | Actual dimension | ACC | REJ |
1 | 2.050±0.05 | N | 2.050 | 2.025 | 2.075 | 2.050 | √ | |
2 | 3.000±0.05 | N | 3.000 | 2.975 | 3.025 | 3.000 | √ | |
| | | | | | | | |
V-CUT Finish dimension (unit: mm): including |
NO | Required Dimension (tolerance) | Actual dimensin | ACC | REJ |
1 | 260.99±0.15 | 261.01 | 260.89 | 261.07 | 261.10 | √ | |
2 | 230.00±0.15 | 229.88 | 229.94 | 230.05 | 230.09 | √ | |
| | | | | | | |
Reference engineering information |
Hole drill drawing | ACC | | | |
Conductor and film | ACC | | | |
Solder mask and film | ACC | | | |
Legend and film | ACC | | | |
Engineering changing | ACC | | | |
E-test Report |
Test Type | General | | Test Parameter |
Special | | Test Votage | 250V |
Single mould | | Test Curent | 100 m A |
Double mould | √ | Conducting Resistance | 20 M ohm |
Flying probe Test | √ | Isolated Resistance | 20 M ohm |
Test Points | 160 | All Open Test | Qualified | √ |
Failure | |
The first pass Qty | 358 | All short Test | Qualified | √ |
Failure | |
Reject Qty | 2 pcs | The first pass Rate | 99% |
Mian Dwfect Desciption: |
1 | Open Qty | 0 PCS | Repaired Qty | 0 PCS | Scrap | 0 PCS | |
2 | Short Qty | 0 PCS | Repaired Qty | 0 PCS | Scrap | 0 PCS | |
3 | Con. Defect | 0 PCS | Repaired Qty | 0 PCS | Scrap | 0 PCS | |
4 | Isolated Defect | 0 PCS | Repaired Qty | 0 PCS | Scrap | 0 PCS | |
5 | Others | 2 PCS | Repaired Qty | 0 PCS | Scrap | 2 PCS | |
Remark: |
Microsection Analysis Report |
purpose & Req | Hole wall | Trace | | |
Copper | ≧ | 20 um | Surface copper | 35 um |
Nickel | ≧ | 0 um | Base copper | 11 um |
Au | ≧ | 0 um | V/X | |
Tin/Lead | ≧ | 3.92 um | | |
Roughness | ≦ | 25 um | | |
Hole wall position Unit: um | A | B | C | D | E | F | Average | Roughness | Speciment Location |
Drill | Plated |
1 | 25.600 | 24.400 | 24.460 | 26.100 | 25.380 | 25.010 | 25.158 | 21.529 | 21.629 | |
2 | 24.221 | 23.021 | 23.081 | 24.721 | 24.001 | 23.631 | 23.779 | 19.327 | 19.427 |
3 | 25.513 | 24.313 | 24.373 | 23.013 | 25.293 | 24.923 | 25.071 | 17.290 | 17.390 |
| Trace Copper | Base Copper | Solder mask thickness | T/L THK | Ni THK | Au THK | Speciment Location |
|
1 | 44.90 | 12.95 | 13.60 | 5.25 | | | |
2 | 44.94 | 12.81 | 12.08 | 8.25 | | |
3 | 42.66 | 10.52 | 15.23 | 6.25 | | |
Defects Inspection |
| Found | NO Found | |
1.Plating crack | | √ |
2.Resion recession | | √ |
3.Plating void | | √ |
4.Delamination | | √ |
5.Smear | | √ |
6.Copper crack | | √ |
7.Blistering | | √ |
8.Interconnection separation | | √ |
9.Laminate void | | √ |
10.wicking | | √ |
11.Nail Heading | | √ |
Reliability Test Report |
NO. | Item | Requirement | Test freqency | Test result |
1 | Solderability test | 245±5℃ 5sec wetting area least 95% | 1 | ACC |
2 | Thermal Stress | 288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall | 1 | ACC |